By Krishnendu Chakrabarty, Visit Amazon's Philip Y. Paik Page, search results, Learn about Author Central, Philip Y. Paik, , Vamsee K. Pamula
Due to expanding energy intake and part density, localized "hot spots" have gotten a major problem in IC (integrated circuit) chip layout - so critical, in truth, that Intel lately needed to yank a circuit since it was once actually burning. For IC engineers grappling with excessive energy dissipation and thermal concerns, new droplet-based cooling concepts utilizing electronic microfluidics expertise may supply the answer. This definitive consultant paves the way in which, with layout and implementation methodologies and prototypes for using this groundbreaking know-how. After reviewing cooling ideas and present bulk cooling equipment, the booklet brings engineers up to the mark on rising droplet-based architectures. Amply illustrated, this milestone paintings will end up valuable in tackling IC warmth matters that latest tools can now not tackle.
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Additional info for Adaptive Cooling of Integrated Circuits Using Digital Microfluidics
Passive cooling devices typically perform worse than active cooling devices. , Peltier/thermoelectric and vapor-compression based). 2 Adaptive Versus Nonadaptive Cooling Within active cooling devices, we can further categorize them by adding the notion of “adaptability” to IC cooling. An adaptive cooling system is one in which a closed-loop feedback of the temperature of the chip is incorporated (either by direct or indirect measurement) in order to create a temperature-aware cooling system that can dynamically cool different areas of the chip.
An electrode is then activated, and the liquid is pulled back, producing a droplet in the process. 8. 8: Time-lapsed sequence of droplet dispensing using an external pressure source. The interdigitated electrodes are spaced 1 mm apart. 9. Liquid is delivered via a micropipettor to the reservoir through a small loading channel connected to a loading port. The electrodes other than those where the droplet is to be formed are then deactivated. The electrode in the reservoir is then activated to retract the liquid, pinching off a droplet in the process.
At the implementation level: 1. The system should have an easily integrable control mechanism. Operation and control of the cooling unit should be simple and easy to integrate. 2. The system should be self-regulating. The system should be able to detect thermal variations on the chip and adjust the flow paths and flow-rates autonomously. The cooling device should operate independently from other components. 3. The system should easily interface with the integrated circuit. The ability to easily interface the cooling device with the IC is important Adaptive Hot-Spot Cooling Principles and Design 51 from a manufacturing standpoint.